A survey of conductive and radiated EMI reduction techniques in power electronics converters across wide‐bandgap devices

Nowadays, wide-bandgap (WBG) devices, primarily made from silicon carbide (SiC) and gallium nitride (GaN), are widely applied in power generation, transmission, conversion. Moreover, the application of WBG devices has had a transformative impact field energy Compared with Si counterparts, SiC GaN can remarkably improve conversion system efficiency density while generating higher electromagnetic interference (EMI) emissions. There many studies on their behaviour systems. However, methods mitigating EMI/electromagnetic compatibility (EMC) still lack scientific guidance. This article reviews characteristics significant EMI problems discussed. Then, types, causes, reduction summarized, advantages disadvantages these presented as well. Based reviewed studies, future research, conclusions this EMI/EMC discussed to help relevant researchers deepen understanding new challenges brought by applications which useful engineering.